From November 7 to 10, Anhui Zhongding Sealing Parts Co., Ltd. successfully completed the issuance of the first tranche of 2025 Sci-Tech Innovation Bonds, with the issuance price setting a historical low record for comparable bonds of the same term, rating, and industry!
Previously, the company had obtained the "Acceptance Registration Notice" from the National Association of Financial Market Institutional Investors (NAFMII), successfully securing a registration quota of RMB 1 billion for medium-term notes, which can be issued in tranches within the valid registration period according to development needs. This tranche of bonds was publicly issued in the national interbank bond market, with an issuance amount of RMB 500 million, a 3-year term, and an issuance interest rate of 1.88%. It was lead-underwritten by China CITIC Bank, with joint underwriting by Industrial and Commercial Bank of China, Bank of China, Shanghai Pudong Development Bank, Bank of Hangzhou, China Minsheng Bank, China Zheshang Bank, Agricultural Bank of China, Industrial Bank, China Construction Bank, and Postal Savings Bank of China. As of November 12, all funds raised from this issuance have been received.
The successful issuance of these Sci-Tech Innovation Bonds fully demonstrates the company's high-quality credit standing and high market recognition. The extremely low financing cost will effectively reduce the company's financial expenses, directly increasing operating profit. The 3-year medium-term term will provide stable medium-to-long-term funds for the company, offering solid financial support for continuously increasing R&D investment and optimizing new business layouts.